Semiconductor Packaging, Reliability & Failure Analysis Services
Quality, Timely, and Cost Effective
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SERVICES

IC Prototype Packaging

IC Repackaging

BGA Reball/Rework

Reliability Testing


BGA Reball / Rework

Our reballing flow process offers information not available from other service providers. This process flow reduces risk and minimizes unnecessary time/testing investment for our customers.


Gold-Flow IR Reflow